Chemicals / Raw Materials for Chemical Products
Morimura and its affiliated companies’ capabilities,
providing new value to Chemical Products.
Chemicals / Raw Materials for Chemical Products
Morimura provides high value-added Chemical Products in collaboration with affiliated companies of outstanding technology. We offer technological propositions for development and manufacturing, through our long-term partnerships with suppliers around the world.
Main Products and Their Application
| Main Products | Application |
|---|---|
| Industrial cleaner / Plating agent / Passivation | SurTec MMC Japan K.K. |
| Surface Treatment for electronic components | MURATA Co., Ltd. |
| Surface Treatment agent for Print Circuit Board | Sanwa Laboratory Ltd. |
| Printing Ink | MORIMURA CHEMICALS Ltd. |
| Filter Cartridges | ROKI TECHNO CO., LTD. |
| Friction Materials (Potassium Titanate) | Toho Material Co., Ltd. |
Chemicals / Raw Materials for Chemical Products List
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Preflux(OSP) is a surface treatment agent which is aimed to prevent a corrosion on copper finished Print Circuit Board and to provide an excellent efficacy when soldering process.
→SANWA LABORATORY LTD. - Water Based Preflux
“Cu Coat Series”
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We can offer solutions for various types of plating chemicals for all processes, including pretreatment and passivation.
Surface Treatment Materials of SurTec
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The cartridge filters have the sophisticated technology of retaining the necessary fine particles and removing the unnecessary bigger and rougher particles.
We can offer the appropriate filter for your application. - Filter Cartridges & Systems
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TOFIX series(Potassium titanate) have good wear resistance and μ-Stability.
→TOHO MATERIAL - Potassium titanate of
TOHO MATERIAL
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PET release liner with several types of release force produced in Clean room. We provide the products to meet customer's requirements in small Lot and short lead time.
- PET Release Liner
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Screen protection film is transparent film in order to maintain visibility and protect the surface of the screen from dirt and damage.
- Screen Protection Film
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Carrier packaging materials for electronic components like semi conductors or micro-chips.
- Embossed Carrier Tape and Cover Tape
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Back Grinding Tape :
Grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding.
Dicing Tape :
Pressuresensitive-adhesive tape is used while dicing various types of wafers. - Back Grinding Tape & Dicing Tape