Chemicals / Raw Materials for Chemical Products
Morimura and its affiliated companies’ capabilities,
providing new value to Chemical Products.
Chemicals / Raw Materials for Chemical Products
Morimura provides high value-added Chemical Products in collaboration with affiliated companies of outstanding technology. We offer technological propositions for development and manufacturing, through our long-term partnerships with suppliers around the world.
Main Products and Their Application
| Main Products | Application |
|---|---|
| Industrial cleaner / Plating agent / Passivation | SurTec MMC Japan K.K. |
| Surface Treatment for electronic components | MURATA Co., Ltd. |
| Surface Treatment agent for Print Circuit Board | Sanwa Laboratory Ltd. |
| Printing Ink | MORIMURA CHEMICALS Ltd. |
| Filter Cartridges | ROKI TECHNO CO., LTD. |
| Friction Materials (Potassium Titanate) | Toho Material Co., Ltd. |
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A nitrogen atom is the heterocyclic compound combined with methylene. It functions as a hardening accelerator added to resin or a synthetic rubber.
- Hexamine
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It is the vegetable oil extracted from the shell of a cashew nut. It used for resin for rubber reinforcement, the property modification use of adhesives, etc.
- Cashew Nuts Shell Liquid
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PET release liner with several types of release force produced in Clean room. We provide the products to meet customer's requirements in small Lot and short lead time.
- PET Release Liner
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Carrier packaging materials for electronic components like semi conductors or micro-chips.
- Embossed Carrier Tape and Cover Tape
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Back Grinding Tape :
Grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding.
Dicing Tape :
Pressuresensitive-adhesive tape is used while dicing various types of wafers. 
Back Grinding Tape & Dicing Tape